Application of electroless Ni-Zn-P film for under-bump metallization on solder joint

Scripta Materialia

Volumn 61, Issue 7, 2009, Pages 748-751

  Tai, F C ^a   Wang, K J ^a   Duh, J G ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

(Ni,Cu)3Sn4 IMC; Ni Zn P film; Thermal stability; X ray diffraction

Indexed keywords

(NI,CU)3SN4 IMC; CHEMICAL SOLUTIONS; ELECTROLESS METHODS; ELECTROLESS NI; INTERMETALLIC COMPOUNDS; LINE PROFILES; NI-ZN-P FILM; SOLDER JOINTS; THERMAL STABILITY; UNDER BUMP METALLIZATION;

CHEMICAL STABILITY; COPPER; DIFFRACTION; NICKEL; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; THERMODYNAMIC STABILITY; TIN; X RAY DIFFRACTION;

ZINC;

EID: 67651011785     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2009.06.024     Document Type: Article

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