Characterisation of the electroless nickel deposit as a barrier layer/under bump metallurgy on IC metallisation

Microelectronic Engineering

Volumn 65, Issue 1-2, 2003, Pages 77-85

  Rohan, James F ^a   O'Riordan, Gerald ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

Barrier; Crystallisation; Electroless; IC metallisation

Indexed keywords

ANNEALING; CRYSTALLIZATION; DIELECTRIC MATERIALS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTROLESS PLATING; ENERGY DISPERSIVE SPECTROSCOPY; NICKEL DEPOSITS; PHOSPHATE DEPOSITS; POLYIMIDES; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION;

ELEMENTAL ANALYSIS;

INTEGRATED CIRCUITS;

EID: 0036891863     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00730-X     Document Type: Article

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