Electroless nickel/gold bump in the flip-chip-type CMOS package for mobile-phone camera modules

Journal of Electronic Materials

Volumn 35, Issue 2, 2006, Pages 273-278

  Kim, Joong Do ^a  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Electroless nickel gold bump; Flip chip type CMOS image sensor package; Wafer bumping

Indexed keywords

CAMERAS; GOLD; IMAGE SENSORS; MOBILE TELECOMMUNICATION SYSTEMS; NICKEL;

ELECTROLESS NICKEL/GOLD BUMP; FLIP-CHIP-TYPE CMOS IMAGE-SENSOR PACKAGE; WAFER BUMPING;

CMOS INTEGRATED CIRCUITS;

EID: 33644918581     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692446     Document Type: Conference Paper

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