Discoloration related failure mechanism and its root cause in Electroless Nickel Immersion Gold (ENIG) Pad metallurgical surface finish

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Volumn , Issue , 2004, Pages 229-233

  Meng, Chong Kam ^a   Selvamuniandy, Tamil Selvy ^a   Gurumurthy, Charan ^b  

^a Intel Technology Malaysia Sdn Bhd   (Malaysia)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CORROSION RESISTANCE; DISCOLORATION; ELECTROLESS PLATING; FAILURE ANALYSIS; GOLD; METALLURGY; OPTIMIZATION; OXIDATION; PRINTED CIRCUIT BOARDS; SOLDERING;

ELECTRICAL TESTING; ELECTROLESS NICKEL AND IMMERSION GOLD (ENIG); PAD METALLURGICAL SURFACE FINISH; TEMPERATURE CYCLES;

NICKEL;

EID: 14844286135     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. Kuldip Johal and Jerry Brewer, "Are You in Control of Your Electroless Nickel/Immersion Gold Process?" Proceedings of IPC Works 2000, Paper no. S03-3, Miami, FL, September 9-14, 2000.
2. Franz Cordes and Ron Huemoeller, "Electroless Nickel-Gold: Is There a Future?" Future Circuits International, Issue 4, 131-134, 1998.
3. Donald Cullen, "Overview and Resolution of Electroless Nickel Immersion Gold Failure Modes," Proceedings of the IPC Printed Circuits Expo 1998, Paper no. S18-5, April 26-30, 1998.
4. Pat Johnson, Zequn Mei, Ali Eslambolchi, and Matt Kaufmann, "Acceptability and Monitoring Tests for Electroless Finish Quality on Laminate Substrates," Proceedings of SemiCon West 1999, G1-9, July 13-14, 1999.
5. Glenn O Mallory & Juan B Hajdu, "Electroless Plating: Fundamental & Application", Nuyes Publication, Dec 1990
6. Wolfang Riedel "Electroless Nickel Plating", Asm Intl Publication, Dec 1991
7. Seraphim, Lasky & Li, "Principles of Electronic Packaging", McgrawHill Publication, 1993 edition
8. A. Molenaar, M.F.E Hordrinet, LKH van Beek, "A Study of the Mechanism of the Electroless Deposition of Nickel", Plating 61, pg 238 (1974)
9. E. Mattson, JO M Bockris, "Galvanic Studies of Deposition and Dissolution of Copper", Trans. Faraday SOC 55, pg 1586, 1959