Influence of the microstructure on the stress state of solder joints dusing thermal cycling

2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009

Volumn , Issue , 2009, Pages

  Menk, Alexander ^a   Bordas, Stephane ^b  

^a ROBERT BOSCH GMBH   (Germany)

^b UNIVERSITY OF GLASGOW   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC MICROSTRUCTURES; CREEP BEHAVIOUR; DAMAGE PROCESS; GRAIN SIZE; NUMERICAL EXPERIMENTS; SOLDER JOINTS; STRESS STATE; THERMOMECHANICAL MISMATCHES;

ANISOTROPY; CREEP; EXPERIMENTS; MICROELECTRONICS; MICROSTRUCTURE; MICROSYSTEMS; TIN; WELDING;

BRAZING;

EID: 67650565646     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2009.4938405     Document Type: Conference Paper

References (12)

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