SCOPUS 정보 검색 플랫폼

Microsystem Technologies

Volumn 15, Issue 7, 2009, Pages 1051-1057

Localised laser joining of glass to silicon with BCB intermediate layer

(3) Wu, Qiang a,b Lorenz, N a Hand, D P a

a HERIOT WATT UNIVERSITY (United Kingdom)

b DUBLIN INSTITUTE OF TECHNOLOGY (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT ENVIRONMENT; BENZOCYCLOBUTENE; DEVICE TEMPERATURE; ELEVATED TEMPERATURE; FINITE ELEMENT SIMULATIONS; FOCUSED LASER BEAMS; HIGH POWER LASER DIODE ARRAYS; IDEAL SOLUTIONS; INTERMEDIATE LAYERS; LASER BONDING; LASER JOINING; LEAK RATE; MICROELECTROMECHANICAL SYSTEMS; TEMPERATURE-SENSITIVE MATERIALS; THERMOSETTING POLYMERS;

BUTENES; COOLING; GLASS; HEATING; HIGH POWER LASERS; LASERS; MEMS; MICROELECTROMECHANICAL DEVICES; PACKAGING MATERIALS; THERMOSETS; WAVEGUIDES;

GLASS BONDING;

EID: 67650435824 PISSN: 09467076 EISSN: None Source Type: Journal
DOI: 10.1007/s00542-009-0879-1 Document Type: Article

Times cited : (18)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.