Packaging for RF MEMS devices using LTCC substrate and BCB adhesive layer

Journal of Micromechanics and Microengineering

Volumn 16, Issue 1, 2006, Pages 150-156

  Kim, Ki Il ^a   Kim, Jung Mu ^a   Kim, Jong Man ^a   Hwang, Gun Chul ^b   Baek, Chang Wook ^c   Kim, Yong Kweon ^a  

^a Seoul National University   (South Korea)

^b Agency for Defence Development   (South Korea)

^c Chung Ang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CERAMIC MATERIALS; LOW TEMPERATURE EFFECTS; MICROELECTROMECHANICAL DEVICES; PHOTOLITHOGRAPHY; SUBSTRATES; WAVEGUIDES;

BENZOCYCLOBUTENE (BCB); CAPPING WAFERS; LOW TEMPERATURE CO-FIRED CERAMICS (LTCC); PACKAGING METHODS;

ELECTRONICS PACKAGING;

EID: 29144481015     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/16/1/020     Document Type: Article

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