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Volumn 59, Issue 19-20, 2005, Pages 2492-2495
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The anodic bonding between K4 glass and Si
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Author keywords
Anodic bonding; Field assisted bonding; Glass; Silicon
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Indexed keywords
ANODES;
BONDING;
ELECTRIC CURRENTS;
ELECTRIC POTENTIAL;
FRACTURE;
INTERFACES (MATERIALS);
MICROSTRUCTURE;
POTASSIUM;
SILICON;
THERMAL EFFECTS;
ANODIC BONDING;
BONDING MECHANISMS;
FIELD-ASSISTED BONDING;
K4 GLASS;
GLASS;
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EID: 20444468850
PISSN: 0167577X
EISSN: None
Source Type: Journal
DOI: 10.1016/j.matlet.2005.03.031 Document Type: Article |
Times cited : (14)
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References (8)
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