메뉴 건너뛰기




Volumn 59, Issue 19-20, 2005, Pages 2492-2495

The anodic bonding between K4 glass and Si

Author keywords

Anodic bonding; Field assisted bonding; Glass; Silicon

Indexed keywords

ANODES; BONDING; ELECTRIC CURRENTS; ELECTRIC POTENTIAL; FRACTURE; INTERFACES (MATERIALS); MICROSTRUCTURE; POTASSIUM; SILICON; THERMAL EFFECTS;

EID: 20444468850     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2005.03.031     Document Type: Article
Times cited : (14)

References (8)
  • 1
    • 0019899398 scopus 로고
    • A batch-fabricated silicon capacitive pressure transducer with low temperature sensitivity [J]
    • Y.S. Lee, and K.D. Wise A batch-fabricated silicon capacitive pressure transducer with low temperature sensitivity [J] IEEE Transactions on Electron Devices ED-29 1982 4248 4252
    • (1982) IEEE Transactions on Electron Devices , vol.ED-29 , pp. 4248-4252
    • Lee, Y.S.1    Wise, K.D.2
  • 2
    • 0025698073 scopus 로고
    • A capacitive pressure sensor with low impendence output and active suppression of parasitic effect
    • B. Puers, E. Peeters, Aa. Van Den Bossche, and W. Sansen A capacitive pressure sensor with low impendence output and active suppression of parasitic effect Sensor and Actuators A21-A23 1990 108 114
    • (1990) Sensor and Actuators , vol.A21-A23 , pp. 108-114
    • Puers, B.1    Peeters, E.2    Van Den Bossche, Aa.3    Sansen, W.4
  • 4
    • 0033338837 scopus 로고    scopus 로고
    • Silicon micro-accelerometer with μ g resolution, high linearity and large frequency bandwidth fabricated with two mask bulk process
    • Zhixiong Xiao, Min Chen, Guoying Wu, Changde Zhao, Dacheng Zhang, Yilong Hao, Guobing Zhang, and Zhihong Li Silicon micro-accelerometer with μ g resolution, high linearity and large frequency bandwidth fabricated with two mask bulk process Sensors and Actuators 77 1999 113 119
    • (1999) Sensors and Actuators , vol.77 , pp. 113-119
    • Zhixiong, X.1    Min, C.2    Guoying, W.3    Changde, Z.4    Dacheng, Z.5    Yilong, H.6    Guobing, Z.7    Zhihong, L.8
  • 5
    • 0025419816 scopus 로고
    • The mechanism of field-assisted silicon-glass bonding
    • Y. Kaanda The mechanism of field-assisted silicon-glass bonding Sensors and Actuators A21-A23 1990 939 943
    • (1990) Sensors and Actuators , vol.A21-A23 , pp. 939-943
    • Kaanda, Y.1
  • 7
    • 0033537532 scopus 로고    scopus 로고
    • Experimental evaluation of anodic bonding process based on the Taguchi analysis of inter fracture toughness
    • Jeung Sang Go, and Young-Ho Cho Experimental evaluation of anodic bonding process based on the Taguchi analysis of inter fracture toughness Sensors and Actuators A 72 2000 52 57
    • (2000) Sensors and Actuators a , vol.72 , pp. 52-57
    • Jeung Sang, G.1    Young-Ho, C.2
  • 8
    • 84980342943 scopus 로고
    • Rate processes during anodic bonding
    • Kevin B. Albaugh Rate processes during anodic bonding Am. Ceram. Soc. 75 1992 2644 2648
    • (1992) Am. Ceram. Soc. , vol.75 , pp. 2644-2648
    • Albaugh Kevin, B.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.