Deposition of dense and smooth Ti films using ECR plasma-assisted magnetron sputtering

Surface and Coatings Technology

Volumn 203, Issue 22, 2009, Pages 3356-3360

  Zhang, Lei ^a   Shi, L Q ^a   He, Z J ^a   Zhang, B ^a   Lu, Y F ^a   Liu, A ^a   Wang, B Y ^b  

^a FUDAN UNIVERSITY   (China)

^b INSTITUTE OF HIGH ENERGY PHYSICS   (China)

Author keywords

ECR plasma; Magnetron sputtering; Ti thin film

Indexed keywords

AFM; ARGON PLASMA BOMBARDMENT; CONVENTIONAL MAGNETRON SPUTTERING; CONVENTIONAL SPUTTERING; DEPOSITION SYSTEMS; DIRECT CURRENT MAGNETRON SPUTTERING; DOPPLER BROADENING; ECR PLASMA; ELECTRON CYCLOTRON RESONANCE PLASMA; HIGH QUALITY; MIRROR-LIKE SURFACE; PREFERRED ORIENTATIONS; SEM; SUBSTRATE BIAS; SUBSTRATE BIAS VOLTAGES; TI FILM; TI THIN FILM; VACANCY DEFECTS; XRD; XRD-PEAK BROADENING;

ARGON; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; BIAS VOLTAGE; CYCLOTRONS; ELECTRON CYCLOTRON RESONANCE; GRAIN REFINEMENT; ION BOMBARDMENT; MAGNETRON SPUTTERING; MAGNETRONS; OCEANOGRAPHIC EQUIPMENT; PHOTOACOUSTIC SPECTROSCOPY; PLASMA DEPOSITION; PLASMAS; POSITRON ANNIHILATION SPECTROSCOPY; POSITRONS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; THIN FILM DEVICES; THIN FILMS; TITANIUM; VACANCIES; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

FILM PREPARATION;

EID: 67649404612     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2009.04.022     Document Type: Article

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