Coating of nanoporous membranes: Atomic layer deposition versus sputtering

Journal of Nanoscience and Nanotechnology

Volumn 9, Issue 6, 2009, Pages 3763-3770

  Grigoras, N K ^a   Airaksinen, V M ^a   Franssila, S ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

ALD; Anodic alumina membrane; Conformal coating; SEM.

Indexed keywords

ALD; ANODIC ALUMINA MEMBRANE; ANODIC ALUMINA MEMBRANES; BOTTOM SURFACES; CONFORMAL COATING; CONFORMALITY; GOLD COATINGS; GOLD LAYER; LAYER THICKNESS; METAL SPUTTERING; NANO-POROUS; NANOPOROUS MEMBRANE; PLANAR SUBSTRATE; SEM.; SILICON SAMPLES;

ALUMINA; ALUMINUM SHEET; ATOMS; COATINGS; GOLD; GOLD DEPOSITS; MEMBRANES; NANOPORES; PLASMA DEPOSITION; SCANNING ELECTRON MICROSCOPY; ZINC; ZINC OXIDE;

ATOMIC LAYER DEPOSITION;

EID: 67649225115     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2009.NS64     Document Type: Conference Paper

References (25)

1. R. W. Tjerkstra, J. G. E. Gardeniers, J. J. Kelly, and A. van den Berg, J. Microelectromech. Sys. 9, 495 (2000).
2. S. B. Lee, D. T. Mitchell, L. Trofin, T. K. Nevanen, H. Soderlund, and Ch. R. Martin, Science 296, 2198 (2002).
3. B. Wolfrum, Y. Mourzina, F. Sommerhage, and A. Offenhausser, Nano Lett. 6, 453 (2006).
4. D. Routkevitch, P. Mardilovich, A. Govyadinov, and T. Yadav, Nanoparticle News 8 (2000).
5. H. Asoh, K. Nishio, M. Nakao, T. Tamamura, and H. Masuda, J. Electwchem. Soc. 148, B152 (2001).
6. A. P. Li, F. Muller, A. Birner, K. Nielsch, and U. Gosele, J. Appl. Pltys. 84, 6023 (1998).
7. S. E. Letant, T. W. van Buuren, and L. J. Terminello, Nano Lett. 4, 1705 (2004).
8. Y. C. Chan, Y.K. Lee, and Y. Zohar, J. Micromech. Microeng. 16, 699 (2006).
9. M. Leskela and M. Ritala, Angew. Client. Int. Ed. 42, 5548 (2003).
10. R. L. Puurunen, J. Appl. Phys. 97, 121301 (2005).
11. H. Kim, J. Vac. Sci. Technol. B 21, 2231 (2003).
12. J. W. Elam, D. Routkevitch, P. P. Mardilovich, and S. M. George, Chem. Mater. 15, 3507 (2003).
13. P. C. Stair, C. Marshall, G. Xiong, H. Feng, M. J. Pellin, J. W. Elam, L. Cutiss, L. Iton, H. Kung, M. Kung, and H.-H. Wang, Top. Catal. 39, 181 (2006).
14. C. R. Stoldt and V. M. Bright, J. Phys. D: Appl. Phys. 39, R163 (2006).
15. R. G. Gordon, D. Hausmann, E. Kim, and J. Shepard, Chem. Vap. Deposition 9, 73 (2003).
16. M. Ritala, M. Kermell, M. Lautala, A. Niskanen, M. Leskela, and S. Lindfors, Chem. Vap. Deposition 12, 655 (2006).
17. M. Kang, L. Trofin, M. O. Mota, and Ch. R. Martin, Anal. Chem. 77, 6243 (2005).
18. D. Pullini, P. Repetto, S. Bernard, L. Doskolovich, and P. Perlo, Appl. Opt. 44, 5129 (2005).
19. K. Grigoras, L. Sainiemi, J. Tiilikainen, A. Saunatjoki, V.-M. Airaksinen, and S. Franssila, J. Physics: Conf. Series 61, 369 (2007).
20. M. C. Salvadori, L. L. Melo, A. R. Vaz, R. S. Wiederkehr, F. S. Teixeira, and M. Cattani, Surface Coatings Technol. 200, 2965 (2006).
21. Y. Jiang, B. Guan, and X.L. Xu, Chin. Phys. Lett. 22, 730 (2005).
22. S.H. K. Park and Y. E. Lee, J. Mater. Sci. 39, 2195 (2004).
23. M. Scharrer, X. Wu, A. Yamilov, H. Cao, and R. P. H. Chang, Appl. Phys. Lett. 86, 151113 (2005).
24. J. Lim and Ch. Lee, Thin Solid Films 515, 3335 (2007).
25. B. Sang and M. Konagai, 25th PVSC 13, 1086 (1996).