-
1
-
-
0030435042
-
Surface engineering and microtribology for microelectromechanical systems
-
Komvopoulos K. Surface engineering and microtribology for microelectromechanical systems. Wear 200 (1996) 305-327
-
(1996)
Wear
, vol.200
, pp. 305-327
-
-
Komvopoulos, K.1
-
2
-
-
0030364402
-
Stiction in surface micromachining
-
Tas N., Sonnenberg T., Jansen H., Legtenberg R., and Elwenspoek M. Stiction in surface micromachining. J Micromech Microeng 6 (1996) 385-397
-
(1996)
J Micromech Microeng
, vol.6
, pp. 385-397
-
-
Tas, N.1
Sonnenberg, T.2
Jansen, H.3
Legtenberg, R.4
Elwenspoek, M.5
-
3
-
-
3943070464
-
Critical review: adhesion in surface micromechanical structures
-
Maboudian R., and Howe R.T. Critical review: adhesion in surface micromechanical structures. J Vac Sci Technol 15 (1997) 1-20
-
(1997)
J Vac Sci Technol
, vol.15
, pp. 1-20
-
-
Maboudian, R.1
Howe, R.T.2
-
4
-
-
0003017182
-
Tribological challenges in micromechanical systems
-
Maboudian R., Ashurst W.R., and Carraro C. Tribological challenges in micromechanical systems. Tribol Lett 12 (2002) 95-100
-
(2002)
Tribol Lett
, vol.12
, pp. 95-100
-
-
Maboudian, R.1
Ashurst, W.R.2
Carraro, C.3
-
5
-
-
0003955123
-
-
Wiley, New York
-
Evans D.F., and Wennerstrom H. The colloidal domain: where physics, chemistry, and biology meet (1999), Wiley, New York
-
(1999)
The colloidal domain: where physics, chemistry, and biology meet
-
-
Evans, D.F.1
Wennerstrom, H.2
-
6
-
-
0032166279
-
A sticking model of suspended polysilicon microstructure including residual stress gradient and postrelease temperature
-
Yee Y., Park M., and Chun K. A sticking model of suspended polysilicon microstructure including residual stress gradient and postrelease temperature. J Microelectromech Syst 7 (1998) 339-344
-
(1998)
J Microelectromech Syst
, vol.7
, pp. 339-344
-
-
Yee, Y.1
Park, M.2
Chun, K.3
-
7
-
-
4344684256
-
Pulsed-laser annealing, a low-thermal-budget technique for eliminating stress gradient in poly-SiGe MEMS structures
-
Sedky S., Howe R.T., and King T.J. Pulsed-laser annealing, a low-thermal-budget technique for eliminating stress gradient in poly-SiGe MEMS structures. J Microelectromech Syst 13 (2004) 669-675
-
(2004)
J Microelectromech Syst
, vol.13
, pp. 669-675
-
-
Sedky, S.1
Howe, R.T.2
King, T.J.3
-
9
-
-
36149056611
-
The adhesion and surface energy of elastic solids
-
Kendall K. The adhesion and surface energy of elastic solids. J Phys D Appl Phys 4 (1971) 1186-1195
-
(1971)
J Phys D Appl Phys
, vol.4
, pp. 1186-1195
-
-
Kendall, K.1
-
10
-
-
0001683519
-
Compressive deformation of a single microcapsule
-
Liu K.K., Williams D.R., and Briscoe B.J. Compressive deformation of a single microcapsule. Phys Rev E 54 (1996) 6673-6680
-
(1996)
Phys Rev E
, vol.54
, pp. 6673-6680
-
-
Liu, K.K.1
Williams, D.R.2
Briscoe, B.J.3
-
11
-
-
0034352196
-
A new model to characterize cell-substrate adhesion in the presence of osmosis
-
Liu K.K., and Wan K.-T. A new model to characterize cell-substrate adhesion in the presence of osmosis. Med Biol Eng Comput 38 (2000) 690-691
-
(2000)
Med Biol Eng Comput
, vol.38
, pp. 690-691
-
-
Liu, K.K.1
Wan, K.-T.2
-
12
-
-
0036522048
-
Adherence of an axisymmetric flat punch onto a clamped circular plate: transition from a rigid plate to a flexible membrane
-
Wan K.-T. Adherence of an axisymmetric flat punch onto a clamped circular plate: transition from a rigid plate to a flexible membrane. J Appl Mech 69 (2002) 110-116
-
(2002)
J Appl Mech
, vol.69
, pp. 110-116
-
-
Wan, K.-T.1
-
13
-
-
0043125766
-
Adhesion of a flat punch adhered to a thin pre-stressed membrane
-
Wan K.-T., and Dillard D.A. Adhesion of a flat punch adhered to a thin pre-stressed membrane. J Adhes 79 (2003) 123-140
-
(2003)
J Adhes
, vol.79
, pp. 123-140
-
-
Wan, K.-T.1
Dillard, D.A.2
-
14
-
-
0037415867
-
A theoretical and numerical study of a thin clamped circular film under an external load in the presence of tensile residual stress
-
Wan K.-T., Guo S., and Dillard D.A. A theoretical and numerical study of a thin clamped circular film under an external load in the presence of tensile residual stress. Thin Solid Films 425 (2003) 150-162
-
(2003)
Thin Solid Films
, vol.425
, pp. 150-162
-
-
Wan, K.-T.1
Guo, S.2
Dillard, D.A.3
-
15
-
-
17444380097
-
The coupling effect of interfacial adhesion and tensile residual stress on a thin membrane adhered to a flat punch
-
Wan K.-T., and Kogut L. The coupling effect of interfacial adhesion and tensile residual stress on a thin membrane adhered to a flat punch. J Micromech Microeng 15 (2005) 778-784
-
(2005)
J Micromech Microeng
, vol.15
, pp. 778-784
-
-
Wan, K.-T.1
Kogut, L.2
-
16
-
-
33646402949
-
Measurement of adhesion energies and Young's modulus in thin polymer films using a novel axi-symmetric peel test geometry
-
Raegen A.N., Dalnoki-Veress K., Wan K.-T., and Jones R.A.L. Measurement of adhesion energies and Young's modulus in thin polymer films using a novel axi-symmetric peel test geometry. Eur Phys J E 19 (2006) 453-459
-
(2006)
Eur Phys J E
, vol.19
, pp. 453-459
-
-
Raegen, A.N.1
Dalnoki-Veress, K.2
Wan, K.-T.3
Jones, R.A.L.4
-
17
-
-
33847021194
-
A novel punch method to characterize interfacial adhesion and residual stress of a thin polymer film
-
Ju B.F., Liu K.K., Wong M.F., and Wan K.-T. A novel punch method to characterize interfacial adhesion and residual stress of a thin polymer film. Eng Fract Mech 74 (2007) 1101-1106
-
(2007)
Eng Fract Mech
, vol.74
, pp. 1101-1106
-
-
Ju, B.F.1
Liu, K.K.2
Wong, M.F.3
Wan, K.-T.4
-
18
-
-
33847719889
-
Adhesion-delamination mechanics of a pre-stressed rectangular film adhered onto a rigid substrate
-
Wong M.F., Duan G., and Wan K.-T. Adhesion-delamination mechanics of a pre-stressed rectangular film adhered onto a rigid substrate. J Appl Phys 101 (2007) 024903
-
(2007)
J Appl Phys
, vol.101
, pp. 024903
-
-
Wong, M.F.1
Duan, G.2
Wan, K.-T.3
-
19
-
-
33847095106
-
Adhesion-delamination mechanics of a pre-stressed circular film adhered onto a rigid substrate
-
Wong M.F., Duan G., and Wan K.-T. Adhesion-delamination mechanics of a pre-stressed circular film adhered onto a rigid substrate. J Adhes 83 (2007) 67-83
-
(2007)
J Adhes
, vol.83
, pp. 67-83
-
-
Wong, M.F.1
Duan, G.2
Wan, K.-T.3
-
20
-
-
0035760824
-
Adherence of an axisymmetric flat punch on a flexible membrane
-
Wan K.-T. Adherence of an axisymmetric flat punch on a flexible membrane. J Adhes 75 (2001) 369-380
-
(2001)
J Adhes
, vol.75
, pp. 369-380
-
-
Wan, K.-T.1
-
21
-
-
34249757815
-
Fracture mechanics of a shaft-loaded blister of thin flexible membrane on rigid substrate
-
Wan K.-T., and Mai Y.M. Fracture mechanics of a shaft-loaded blister of thin flexible membrane on rigid substrate. Int J Fract 74 (1995) 181-197
-
(1995)
Int J Fract
, vol.74
, pp. 181-197
-
-
Wan, K.-T.1
Mai, Y.M.2
-
22
-
-
0001324894
-
Measuring mechanical properties of thin flexible films by a shaft-loaded blister test
-
Wan K.-T., and Liao K. Measuring mechanical properties of thin flexible films by a shaft-loaded blister test. Thin Solid Films 352 (1999) 167-172
-
(1999)
Thin Solid Films
, vol.352
, pp. 167-172
-
-
Wan, K.-T.1
Liao, K.2
-
23
-
-
0036522192
-
Adherence of a rectangular flat punch onto a clamped plate: transition from a rigid plate to a flexible membrane
-
Wan K.-T., and Duan J. Adherence of a rectangular flat punch onto a clamped plate: transition from a rigid plate to a flexible membrane. J Appl Mech 69 (2002) 104-109
-
(2002)
J Appl Mech
, vol.69
, pp. 104-109
-
-
Wan, K.-T.1
Duan, J.2
-
24
-
-
16344364518
-
A systematic method for characterizing the elastic properties and adhesion of a thin polymer membrane
-
Ju B.F., Ju Y., Saka M., Liu K.K., and Wan K.-T. A systematic method for characterizing the elastic properties and adhesion of a thin polymer membrane. Int J Mech Sci 47 (2005) 319-332
-
(2005)
Int J Mech Sci
, vol.47
, pp. 319-332
-
-
Ju, B.F.1
Ju, Y.2
Saka, M.3
Liu, K.K.4
Wan, K.-T.5
-
25
-
-
34249035152
-
The effects of tensile residual stress and sliding boundary on measuring the adhesion work of membrane by pull-off test
-
Wang S., and Li X. The effects of tensile residual stress and sliding boundary on measuring the adhesion work of membrane by pull-off test. Thin Solid Films 515 (2007) 7227-7231
-
(2007)
Thin Solid Films
, vol.515
, pp. 7227-7231
-
-
Wang, S.1
Li, X.2
-
26
-
-
49749084719
-
Decohesion of a rigid punch from nonlinear membrane undergoing finite axisymmetric deformation
-
Nadler B., and Tang T. Decohesion of a rigid punch from nonlinear membrane undergoing finite axisymmetric deformation. Int J Non-linear Mech 43 (2008) 716-721
-
(2008)
Int J Non-linear Mech
, vol.43
, pp. 716-721
-
-
Nadler, B.1
Tang, T.2
-
29
-
-
47749142788
-
A theoretical study of a thin film delamination using shaft-loaded blister test: constitutive relation without delamination
-
Jin C., and Wang X.D. A theoretical study of a thin film delamination using shaft-loaded blister test: constitutive relation without delamination. J Mech Phys Solids 56 (2008) 2815-2831
-
(2008)
J Mech Phys Solids
, vol.56
, pp. 2815-2831
-
-
Jin, C.1
Wang, X.D.2
-
30
-
-
0022880338
-
Proof of a conjecture in elastic membrane theory
-
Steigmann D.J. Proof of a conjecture in elastic membrane theory. J Appl Mech 53 (1986) 955-956
-
(1986)
J Appl Mech
, vol.53
, pp. 955-956
-
-
Steigmann, D.J.1
-
31
-
-
84972033253
-
Stable and unstable axisymmetric solutions for membranes of revolution
-
Weinitschke H.J. Stable and unstable axisymmetric solutions for membranes of revolution. Appl Mech Rev 42 (1989) 289-294
-
(1989)
Appl Mech Rev
, vol.42
, pp. 289-294
-
-
Weinitschke, H.J.1
-
32
-
-
0009452110
-
Wrinkle-free solutions of circular membrane problems
-
Beck A., and Grabmüller H. Wrinkle-free solutions of circular membrane problems. Z Angew Math Phys 43 (1992) 481-504
-
(1992)
Z Angew Math Phys
, vol.43
, pp. 481-504
-
-
Beck, A.1
Grabmüller, H.2
-
33
-
-
33747067861
-
Large axisymmetric deformations of elastic circular membranes
-
Foroutan-Naini F., and Peddieson J. Large axisymmetric deformations of elastic circular membranes. Mech Res Commun 11 (1984) 67-74
-
(1984)
Mech Res Commun
, vol.11
, pp. 67-74
-
-
Foroutan-Naini, F.1
Peddieson, J.2
-
34
-
-
4143088948
-
Large deformations under vertical edge loads of annular membranes with various strain energy densities
-
Fulton J.P., and Simmonds J.G. Large deformations under vertical edge loads of annular membranes with various strain energy densities. Int J Non-Linear Mech 21 (1986) 257-267
-
(1986)
Int J Non-Linear Mech
, vol.21
, pp. 257-267
-
-
Fulton, J.P.1
Simmonds, J.G.2
-
35
-
-
58149330791
-
Linearly elastic annular and circular membranes under radial, transverse, and torsional loading. Part I: large unwrinkled axisymmetric deformations
-
Plaut R.H. Linearly elastic annular and circular membranes under radial, transverse, and torsional loading. Part I: large unwrinkled axisymmetric deformations. Acta Mech 202 (2009) 101-110
-
(2009)
Acta Mech
, vol.202
, pp. 101-110
-
-
Plaut, R.H.1
-
36
-
-
6044237676
-
Large deflection of a circular plate with a circular hole at the center
-
Yeh K.Y. Large deflection of a circular plate with a circular hole at the center. Acta Sci Sin 2 (1953) 127-144
-
(1953)
Acta Sci Sin
, vol.2
, pp. 127-144
-
-
Yeh, K.Y.1
-
37
-
-
0037460390
-
A shaft-loaded blister test for elastic response and delamination behavior of thin film-substrate system
-
Xu X., Shearwood C., and Liao K. A shaft-loaded blister test for elastic response and delamination behavior of thin film-substrate system. Thin Solid Films 424 (2003) 115-119
-
(2003)
Thin Solid Films
, vol.424
, pp. 115-119
-
-
Xu, X.1
Shearwood, C.2
Liao, K.3
|