A novel cylindrical punch method to characterize interfacial adhesion and residual stress of a thin polymer film

Engineering Fracture Mechanics

Volumn 74, Issue 7, 2007, Pages 1101-1106

  Ju, Bing Feng ^a   Liu, Kuo Kang ^b   Wong, Ming Fung ^c   Wan, Kai Tak ^c  

^a ZHEJIANG UNIVERSITY   (China)

^b KEELE UNIVERSITY   (United Kingdom)

^c University of Missouri Rolla   (United States)

Author keywords

Adhesion; Contact mechanics; Delamination; Interface; Surface forces; Thin film

Indexed keywords

ADHESION; DELAMINATION; RESIDUAL STRESSES; SYNTHETIC RUBBER; THIN FILMS;

CONTACT MECHANICS; CYLINDRICAL PUNCH METHOD; SILICONE RUBBER FILM; SURFACE FORCES; THIN POLYMER FILM;

PLASTIC FILMS;

ADHESION; DELAMINATION; PLASTIC FILMS; RESIDUAL STRESSES; SYNTHETIC RUBBER; THIN FILMS;

EID: 33847021194     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.engfracmech.2006.12.010     Document Type: Article

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