Adhesion-delamination mechanics of a prestressed rectangular film adhered onto a rigid substrate

Journal of Applied Physics

Volumn 101, Issue 2, 2007, Pages

  Wong, Ming Fung ^a   Duan, Gang ^a   Wan, Kai Tak ^a  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION ENERGY; CIRCULAR FILMS; CONTACT AREA; FREQUENCY SWITCHES;

ADHESION; DELAMINATION; MATHEMATICAL MODELS; MEMS; THERMODYNAMICS;

THIN FILMS;

EID: 33847719889     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2422775     Document Type: Article

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