Effects of aging and thermal cycling on the microstructure and shear strength of SnAgCu surface mount solder joint

Jinshu Xuebao/Acta Metallurgica Sinica

Volumn 37, Issue 4, 2001, Pages 439-444

  Shawkret, Ahat ^a   Du, Liguang ^a   Sun, Zhiguo ^a   Sheng, Mei ^a   Luo, Le ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

Aging; Intermetallics; SnAgCu solder; Surface mount technology (SMT); Thermal cycling

Indexed keywords

EID: 0035906132     PISSN: 04121961     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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