Microstructure of Sn-3.5Ag-0.5Cu/Cu interface

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 16, Issue 3, 2006, Pages 495-499

  Wang, Ye ^a   Huang, Ji Hua ^a   Zhang, Jian Gang ^a   Qi, Li Hua ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Intermetallic compound (IMC); Isothermal aging; Sn 3.5Ag 0.5Cu Cu interface; Thermal shearing cycling

Indexed keywords

BRAZING FILLER METALS; COPPER ALLOYS; INTERFACES (MATERIALS); INTERMETALLICS; SILVER ALLOYS; TIN ALLOYS;

AGING TIME; INTERMETALLIC COMPOUND (IMC); ISOTHERMAL AGING; THERMAL SHEARING CYCLING;

MICROSTRUCTURE;

EID: 33646878606     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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