Wetting match performance of SnAgCuRE lead-free solder for surface mount component

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 16, Issue 11, 2006, Pages 1908-1912

  Zhang, Ke Ke ^a   Wang, Shuang Qi ^a   Yu, Yang Chun ^a   Wang, Yao Li ^a   Fan, Yan Li ^a   Cheng, Guang Hui ^a   Han, Li Juan ^a  

^a HENAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Lead free solder; Surface mount component; Wetting force; Wetting property

Indexed keywords

PREHEATING; RARE EARTHS; SURFACE MOUNT TECHNOLOGY; WETTING;

LEAD FREE SOLDER; SURFACE MOUNT COMPONENT; WETTING FORCE; WETTING PROPERTY;

SOLDERING ALLOYS;

EID: 33846373655     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (16)

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