Research on creep properties of Sn2.5Ag0.7CuXRE lead-free soldered joints for surface mount technology

Key Engineering Materials

Volumn 353-358, Issue PART 4, 2007, Pages 2912-2915

  Zhang, K K ^a   Wang, Y L ^a   Fan, Y L ^a   Yang, J ^a   Yan, Y F ^a   Zhang, X ^a  

^a HENAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Creep behavior; SnAgCuRE; Soldered joint reliability; Surface mount technology

Indexed keywords

CREEP; FINITE ELEMENT METHOD; RELIABILITY THEORY; SHEAR STRAIN; SURFACE MOUNT TECHNOLOGY; TIN;

CONSTANT TEMPERATURE; CREEP BEHAVIOR; RUPTURE LIFE; SOLDERED JOINT RELIABILITY;

SOLDERED JOINTS;

EID: 36048964538     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-456-1.2912     Document Type: Conference Paper

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