Surface activation process of lead-free solder bumps for low temperature bonding

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages 404-407

  Wang, YingHui ^a   Nishida, Kenji ^b   Hutter, Matthias ^c   Howlader, Matiar R ^d   Higurashi, Eiji ^d   Kimura, Takashi ^b   Suga, Tadatomo ^a  

^a UNIVERSITY OF TOKYO   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^c FRAUNHOFER IZM   (Germany)

^d UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DENSITY (SPECIFIC GRAVITY); ELECTRONICS PACKAGING; FLIP CHIP DEVICES; LOW TEMPERATURE ENGINEERING; SCANNING ELECTRON MICROSCOPY; SURFACE TREATMENT; TENSILE TESTING;

BONDING STRENGTH; ELECTRON PROBE MICRO ANALYZER (EPMA); FLIP CHIP BONDING; LOW TEMPERATURE BONDING;

SOLDERING ALLOYS;

EID: 33846309614     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564688     Document Type: Conference Paper

References (15)

1. Tummala R. R., Fundamentals of Microsystems Packaging, McGraw-Hill (2001), pp. 361-390.
2. Abtew M., and Selvaduray G., "Lead-free Solders in Microelectronics", Materials Science and Engineering, Vol.27, (2001), pp. 95-141.
3. th Electronic Components and Technology Conf, May. 2004, pp. 49-57.
4. Turbini L. J., Munie G.C., Bernier D., Gamalski J., and Bergman D.W., "Examining the Environmental Impact of Lead-free Soldering Alternatives", IEEE Trans-CPMT, Vol. 24, No. 1(2001), pp. 4-9.
5. Baggerman A. F. J., Batenburg M. J., "Reliability Au-Sn Flip-chip Bonding on Flexible Prints", IEEE Trans-CPMT-B, Vol. 18, No. 2 (1995), pp. 257-263.
6. Sun W., and Ivey D. G., "Microstructural Study of Co-electroplated Au/Sn Alloys", Journal of Materials Science, Vol. 36, (2001), pp.757-766.
7. Ivey D. G., "Microstructural Characterization of Au/Sn Solder for Packaging in Optoelectronic Applications", Micron, Vol. 29, No. 4 (1998), pp. 281-287.
8. Matijasevic G. S., Lee C. C., and Wang C. Y., "Au-Sn Alloy Phase Diagram and Properties Related to Its Use as a Bonding Medium", Thin Solid Films, Vol. 223, (1993), pp. 276-287.
9. Chuang R. W., Kim D., Park J. and Lee C. C., "A Fluxless Process of Producing Tin-Rich Gold-Tin Joints in Air", IEEE Trans-CPMT, Vol. 27, No. 1 (2004), pp. 117-181.
10. Takagi H., Maeda R., Chung T. R., Hosoda N., and Suga T., "Effect of Surface Roughness on Room-temperature Wafer Bonding", Jpn. J. Appl. Phys., Vol. 37, (1998), pp.4197-4203.
11. th Electronic Components and Technology Conf, May. 2002, pp. 915-919.
12. th Electronic Components and Technology Conf, May. 2001, pp. 384-397.
13. th Electronic Components and Technology Conf, May. 2002, pp. 105-111.
14. Marinkovic Z. and Simic V., "Comparative analysis of interdiffusion in some thin film metal couples at room temperature", Thin Solid Films, Vol. 217 (1992), pp. 26-30.
15. Tu K. N., "Interdiffusion and Reaction in Bimetallic Cu-Sn Thin Films", Acta Metalllurgica, Vol. 21, (1973), pp.347-353.