Effect of additives in organic acid solutions for post-CMP cleaning on polymer low- k fluorocarbon

Journal of the Electrochemical Society

Volumn 156, Issue 6, 2009, Pages

  Gu, Xun ^a   Nemoto, Takenao ^a   Teramoto, Akinobu ^a   Ito, Takashi ^a   Ohmi, Tadahiro ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACID SOLUTIONS; CLEANING SOLUTIONS; DIELECTRIC CONSTANTS; ELECTRICAL DEGRADATIONS; FLUORINE CONTENTS; FLUOROCARBON FILMS; HIGH RESOLUTIONS; OXALIC ACIDS; POST-CMP CLEANINGS; ULTRA-LOW-K; X-RAY PHOTOELECTRON SPECTROSCOPIES;

CERAMIC CAPACITORS; CHEMICAL CLEANING; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; DEGRADATION; DIELECTRIC WAVEGUIDES; FLUORINE; NANOTECHNOLOGY; ORGANIC ACIDS; PERMITTIVITY; PHOTODEGRADATION; X RAY PHOTOELECTRON SPECTROSCOPY;

DIELECTRIC MATERIALS;

EID: 65449186575     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3106106     Document Type: Article

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