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Volumn 47, Issue 4 PART 2, 2008, Pages 2515-2520
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Low-dielectric-constant nonporous fluorocarbon films for interlayer dielectric
a,b
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Author keywords
Chemical vapor deposition (CVD); Fluorocarbon film; Interlayer dielectric; Low dielectric constant; Microwave excited plasma; Nonporous
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Indexed keywords
CHEMICAL VAPOR DEPOSITION;
CYCLOTRONS;
DIELECTRIC MATERIALS;
ELECTRON CYCLOTRON RESONANCE;
ELECTRON TEMPERATURE;
FLOW PATTERNS;
GASES;
HEAT RESISTANCE;
LEAKAGE CURRENTS;
MICROWAVES;
PERMITTIVITY;
PLASMA DEPOSITION;
PLASMA DEVICES;
PLASMA THEORY;
PLATES (STRUCTURAL COMPONENTS);
CONVENTIONAL PLASMAS;
DIFFUSION PLASMAS;
ELECTRON CYCLOTRON RESONANCE PLASMAS;
FLUOROCARBON FILM;
FLUOROCARBON FILMS;
GAS FLOW PATTERNS;
HIGH HEAT RESISTANCES;
HIGH-DENSITY;
INTERLAYER DIELECTRIC;
INTERLAYER DIELECTRICS;
LOW DIELECTRIC CONSTANT;
LOW ELECTRON TEMPERATURES;
MECHANICAL STRENGTHS;
NEW SYSTEMS;
NONPOROUS;
PLASMA EXCITATIONS;
PLATE STRUCTURES;
SURFACE SMOOTHNESSES;
ULTRA-LARGE-SCALE INTEGRATIONS;
PLASMAS;
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EID: 54249141053
PISSN: 00214922
EISSN: 13474065
Source Type: Journal
DOI: 10.1143/JJAP.47.2515 Document Type: Article |
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Times cited : (19)
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References (13)
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