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Volumn 44, Issue 1 A, 2005, Pages 75-81
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Structural studies of high-performance low-k dielectric materials improved by electron-beam curing
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Author keywords
Cu damascene; EB curing; EXAFS; Ladder structure; Low k dielectric; Methylsilsesquioxane; Random structure; XAFS; XANES
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Indexed keywords
ABSORPTION;
CHEMICAL BONDS;
CHEMICAL VAPOR DEPOSITION;
CURING;
ELECTRON BEAMS;
RUTHERFORD BACKSCATTERING SPECTROSCOPY;
CU DAMASCENE;
EB CURING;
EXTENDED X-RAY ABSORPTION FINE STRUCTURE (EXAFS);
LADDER STRUCTURES;
LOW-K DIELECTRIC;
METHYLSILSQUIOXANE;
RANDOM STRUCTURES;
X-RAY ABSORPTION FINE STRUCTURE (XAFS);
X-RAY ABSORPTION NEAR-EDGE STRUCTURE (XANES);
DIELECTRIC MATERIALS;
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EID: 15544366132
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/JJAP.44.75 Document Type: Article |
Times cited : (16)
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References (20)
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