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Volumn 42, Issue 4 B, 2003, Pages 1911-1915
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High-quality silicon oxide film formed by diffusion region plasma enhanced chemical vapor deposition and oxygen radical treatment using microwave-excited high-density plasma
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Author keywords
High density plasma; Low temperature; PECVD; Post treatment; Silicon oxide; Silicon oxide on poly Si
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Indexed keywords
CAPACITANCE;
CURRENT VOLTAGE CHARACTERISTICS;
DIFFUSION;
ELECTRIC FIELDS;
GRAIN SIZE AND SHAPE;
KRYPTON;
LEAKAGE CURRENTS;
OXYGEN;
PLASMA DENSITY;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
SEMICONDUCTING FILMS;
CAPACITANCE-VOLTAGE CHARACTERISTICS;
HIGH TEMPERATURE THERMAL OXIDE FILM;
MICROWAVE-EXCITED HIGH-DENSITY PLASMA;
OXYGEN RADICAL TREATMENT;
SILICON OXIDE FILM;
SEMICONDUCTING SILICON COMPOUNDS;
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EID: 0038686578
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/jjap.42.1911 Document Type: Article |
Times cited : (27)
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References (12)
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