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Volumn 517, Issue 14, 2009, Pages 3841-3843

Characterization and Cu electroless plating of laser-drilled through-wafer via-holes in GaN/Al2O3

Author keywords

Cu plating; GaN; Laser drilling

Indexed keywords

CU PLATING; DEVICE INTEGRATIONS; DEVICE LAYOUTS; DRILLED HOLES; GAN; HIGH-POWER; LASER DRILLING; MICRO-RAMAN SPECTROSCOPIES; ND : YAG LASERS; SEM/EDX; VIA-HOLES;

EID: 65449150093     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.01.160     Document Type: Article
Times cited : (2)

References (14)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.