Adhesive and dielectric properties of novel polyimides with bis(3,3′-aminophenyl)-2,3,5,6-tetrafluoro-4-trifluoromethyl phenyl phosphine oxide (mDA7FPPO)

European Polymer Journal

Volumn 45, Issue 6, 2009, Pages 1652-1658

  Choi, Jun Keol ^a   Paek, Kwan Yeol ^a   Yoon, Tae Ho ^a  

^a Gwangju Institute of Science and Technology (GIST)   (South Korea)

Author keywords

Adhesive property; Dielectric constant; Fluorine; Peel strength; Phosphine oxide; Polyimide

Indexed keywords

ADHESIVE PROPERTY; DIELECTRIC CONSTANT; HIGH-T; IMIDIZATION; INTRINSIC VISCOSITIES; LOW DIELECTRIC CONSTANTS; NOVEL POLYIMIDES; PEEL STRENGTH; PHOSPHINE OXIDE; PYROMELLITIC DIANHYDRIDE; RIGID RODS; THERMAL STABILITIES; TRIFLUOROMETHYL; TWO-STEP PROCESS;

AMINES; DIELECTRIC WAVEGUIDES; FLUORINE; NEMATIC LIQUID CRYSTALS; PERMITTIVITY; PHOSPHORUS COMPOUNDS; POLYIMIDES; POLYMERS; SOLUBILITY; TERNARY SYSTEMS;

CERAMIC CAPACITORS;

EID: 65149104430     PISSN: 00143057     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.eurpolymj.2009.03.009     Document Type: Article

References (32)

1. Fegar C., Khojasteh M.M., and Htoo M.S. Advances in polyimide science and technology (1993), Technomic Publishing, New York
2. In: Ghosh M.K., and Mittal K.L. (Eds). Polyimides: fundamentals and applications (1996), Marcel Dekker, New York
3. Maier G. Low dielectric constant polymers for microelectronics. Prog Polym Sci 26 (2001) 3-65
4. Auman BC. Low dielectric constant, low moisture absorption and low CTE polyimide based on new rigid fluorinated monomers. In Ref. [1]. p. 15-32.
5. Sasaki S, Nishi S. Synthesis of fluorinated polyimides: in polyimides: fundamentals and applications. In Ref. [2]. p. 71-120.
6. Hedrick J.L., Labadie J.W., Russell T.P., Hofer D., and Wakharkar V. High temperature polymer foams. Polymer 34 (1993) 4717-4726
7. Remenar J.F., Hawker C.J., Hedrick J.L., Kim S.M., Miller R.D., Nguyen C.V., et al. Templating nanopores into poly(methylsilsesquioxane): new low-dielectric coatings suitable for microelectronic applications. Mater Res Soc Symp Porc 511 (1998) 69-74
8. Chu H.J., Zhu B.K., and Xu Y.Y. Preparation and dielectric properties of polyimide foams containing crosslinked structures. Polym Adv Technol 17 (2006) 366-371
9. Wahab M.A., Mya K.Y., and He C. Synthesis, morphology and properties of hydroxyl terminated-POSS/polyimide low-k nanocomposite films. J Polym Sci A Polym Chem 46 (2008) 5887-5896
10. Ye Y.S., Chen W.Y., and Wang Y.Z. Synthesis and properties of low-dielectric-constant polyimides with introduced reactive fluorine polyhedral oligomeric silsesquioxanes. J Polym Sci A Polym Chem 44 (2006) 5391-5402
11. Lee Y.J., Huang J.M., Kuo S.W., and Chang F.C. Low-dielectric, nanoporous polyimide films prepared from PEO-POSS nanoparticles. Polymer 46 (2005) 10056-10065
12. Wu S., Hayakawa T., Kakimoto M.A., and Oikawa H. Synthesis and characterization of organosoluble aromatic polyimides containing POSS in main chain derived from double-decker-shaped silsesquioxane. Macromolecules 41 (2008) 3481-3487
13. Critchley J.P., Grattan P.A., White M.A., and Pippett J.S. Perfluoroalkylene-linked aromatic polyimides. I. synthesis, structure, and some general physical characteristics. J Polym Sci A Poly Chem 10 (1972) 1789-1807
14. Chern Y.T., and Shiue H.C. High subglass transition temperatures and low dielectric constants of polyimides derived from 4,9-bis(4-aminophenyl)diamantane. Chem Mater 10 (1998) 210-216
15. Ku C.K., Ho C.H., Chen T.S., and Lee Y.D. Synthesis and characterization of pyridine-containing poly(imide-siloxane)s and their adhesion to copper foil. J Appl Polym Sci 104 (2007) 2561-2568
16. Lee Y.J., Gungor A., Yoon T.H., and McGrath J.E. Adhesive and thermo-mechanical behavior of phosphorus-containing thermoplastic polyimides. J Adhesion 55 (1995) 165-177
17. Miyamura T., and Koike J. The effect of Cr oxidation and polyimide degradation in interface adhesion strength in Cu/Cr/polyimide flexible films. Mater Sci Eng A 445-446 (2007) 620-624
18. Chung Y.M., and Han J.G. High adhesive metal laminate manufacturing by low energy ion cascade treatments. Surf Coat Technol 201 (2007) 5030-5034
19. Lin Y.S., Liu H.M., and Chen C.L. Plasma surface modification of polyimide films by air glow discharge for copper metallization on microelectronic flex substrates. Surf Coat Technol 200 (2006) 3775-3785
20. Jang J., and Earmme T. Interfacial study of polyimide/copper system using silane-modified polyvinylimidazoles as adhesion promoters. Polymer 42 (2001) 2871-2876
21. Chan-Park M.B., and Tan S.S. Thermal graft copolymerization of 4-vinyl pyridine on polyimide to improve adhesion to copper. Inter J Adhes Adhes 22 (2002) 471-475
22. Inagaki N., Tasaka S., and Masumoto M. Improved adhesion between Kapton film and copper metal by plasma graft polymerization of vinylimidazole. Macromolecules 29 (1996) 1642-1648
23. Wang W.C., Vora R.H., Kang E.T., and Neoh K.G. Electroless plating of copper on fluorinated polyimide films modified by surface graft copolymerization with 1-vinylimidazole and 4-vinylpyridine. Polym Eng Sci 44 (2004) 362-375
24. Park J.Y., Jung Y.S., Cho J., and Choi W.K. Chemical reaction of sputtered Cu film with PI modified by low energy reactive atomic beam. Appl Surf Sci 252 (2006) 5877-5891
25. Hong J.H., Lee Y.H., Han S.H., and Kim K.J. Improvement of adhesion properties for Cu films on the polyimide by plasma source ion implantation. Surf Coat Technol 201 (2006) 197-202
26. Jeong K.U., Jo Y.J., and Yoon T.H. Synthesis and characterization of novel polyimide from bis-(3-aminophenyl)-4-(trifluoromethyl)phenyl phosphine oxide. J Polym Sci A Polym Chem 39 (2001) 3335-3347
27. Jeong K.U., Kim J.J., and Yoon T.H. Synthesis and characterization of novel polyimides containing fluorine and phosphine oxide moieties. Polymer 42 (2001) 6019-6030
28. Myung B.Y., Kim J.J., and Yoon T.H. Synthesis and characterization of novel 3,6-di[3,5-bis(trifluoromethyl)phenyl]pyromellitic dianhydride for polyimide synthesis. J Polym Sci A Polym Chem 40 (2002) 4217-4227
29. Myung B.Y., Kim J.J., and Yoon T.H. Adhesion properties of 12FPMDA-based polyimides containing a trifluoromethylphenyl moiety. J Adhes Sci Technol 17 (2003) 1669-1684
30. Lee C.W., Kwak S.M., and Yoon T.H. Synthesis and characterization of polyimides from bis(3-aminophenyl)-2,3,5,6-tetrafluoro-4-trifluoromethylphenyl phosphine oxide (mDA7FPPO). Polymer 47 (2006) 4140-4147
31. Tomikawa M., Harris F.W., Cheng S.Z.D., and Galentier E. Synthesis and photo-induced solution properties of new rigid-rod polyimides. React Funct Polym 30 (1996) 101-107
32. Harris F.W., and Hsu S.L.C. Synthesis and characterization of polyimides based on 3,6-diphenylpyromellitic dianhydride. High Perform Polym 1 (1989) 3-16