Interfacial study of polyimide/copper system using silane-modified Polyvinylimidazoles as adhesion promoters

Polymer

Volumn 42, Issue 7, 2001, Pages 2871-2876

  Jang, J ^a   Earmme, T ^a  

^a Seoul National University   (South Korea)

Author keywords

Adhesion promotion; Polyimide on copper; Silane modified polyvinylimidazole

Indexed keywords

COPPER DERIVATIVE; IMIDAZOLE DERIVATIVE; POLYIMIDE; SILANE DERIVATIVE; VINYL DERIVATIVE;

ADHESION; ARTICLE; CHEMICAL INTERACTION; CONTACT ANGLE; INFRARED SPECTROSCOPY; OXIDATION; SCANNING ELECTRON MICROSCOPY; SHEAR STRESS; STRENGTH; TEMPERATURE;

EID: 0035131876     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0032-3861(00)00701-1     Document Type: Article

References (30)