Plasma surface modification of polyimide films by air glow discharge for copper metallization on microelectronic flex substrates

Surface and Coatings Technology

Volumn 200, Issue 12-13, 2006, Pages 3775-3785

  Lin, Y S ^a   Liu, H M ^a   Chen, C L ^a  

^a FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

Adhesion; AFM; Air plasma; ESCA; Surface modification

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; COPPER; ELECTRON SPECTROSCOPY; GLOW DISCHARGES; METALLIZING; PLASMA APPLICATIONS; PLASTIC FILMS; SPUTTERING; STRENGTH OF MATERIALS; SURFACE ROUGHNESS; SURFACE TREATMENT;

ADHESIVE STRENGTH; AIR PLASMA; PLASMA SURFACE MODIFICATION; POLYIMIDE FILMS; SESSILE DROP;

POLYIMIDES;

ADHESION; ATOMIC FORCE MICROSCOPY; COPPER; ELECTRON SPECTROSCOPY; GLOW DISCHARGES; METALLIZING; PLASMA APPLICATIONS; PLASTIC FILMS; POLYIMIDES; SPUTTERING; STRENGTH OF MATERIALS; SURFACE ROUGHNESS; SURFACE TREATMENT;

EID: 32644464683     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2004.11.031     Document Type: Article

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