Improvement of adhesion properties for Cu films on the polyimide by plasma source ion implantation

Surface and Coatings Technology

Volumn 201, Issue 1-2, 2006, Pages 197-202

  Hong, Ju Hi ^a   Lee, Yeonhee ^b   Han, Seunghee ^b   Kim, Kang Jin ^a  

^a Korea University   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

Author keywords

Adhesion; Auger electron spectroscopy (AES); Ion beam deposition; Plasma source ion implantation; Polyimide

Indexed keywords

ADHESION; AUGER ELECTRON SPECTROSCOPY; COPPER; DEPOSITION; ION IMPLANTATION; PEELING; PLASMA SOURCES; SCANNING ELECTRON MICROSCOPY;

ADHESION PROPERTIES; COPPER FILMS; ION-BEAM DEPOSITION; PLASMA SOURCE ION IMPLANTATION;

POLYIMIDES;

ADHESION; AUGER ELECTRON SPECTROSCOPY; COPPER; DEPOSITION; ION IMPLANTATION; PEELING; PLASMA SOURCES; POLYIMIDES; SCANNING ELECTRON MICROSCOPY;

EID: 33745962603     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.11.084     Document Type: Article

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