Templating nanopores into poly(methylsilsesquioxane): new low-dielectric coatings suitable for microelectronic applications

Materials Research Society Symposium - Proceedings

Volumn 511, Issue , 1998, Pages 69-74

  Remenar, Julius F ^a   Hawker, Craig J ^a   Hedrick, James L ^a   Kim, Sung Mog ^a   Miller, Robert D ^a   Nguyen, Cattien ^a   Trollsas, Mikael ^a   Yoon, Do Y ^a  

^a IBM ALMADEN RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CROSSLINKING; DIELECTRIC FILMS; GLASS; HEATING; MORPHOLOGY; NANOSTRUCTURED MATERIALS; PERMITTIVITY; POROSITY; PROTECTIVE COATINGS; PYROLYSIS;

POLYCAPROLACTONE; POLYMETHYLSILSESQUIOXANE; TEMPLATING NANOPORES;

PLASTIC FILMS;

EID: 0032296319     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-511-69     Document Type: Conference Paper

References (4)