Impact of slip and contact angle on imprinting pressure in nanoimprint lithography

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 27, Issue 2, 2009, Pages 590-596

  Lee, Young Hoon ^a   Sin, Hyo Chol ^a   Kim, Nam Woong ^b  

^a Seoul National University   (South Korea)

^b Dongyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

FILLING PROCESS; MOLD PATTERNS; NANO-METER SCALE; NO-SLIP CONDITIONS; POLYMER RESISTS; PROCESS SPEED; RESIDUAL THICKNESS; SLIP CONDITIONS; THERMAL NANOIMPRINT LITHOGRAPHIES;

ADHESION; COMPUTATIONAL FLUID DYNAMICS; CONTACT ANGLE; FLUID DYNAMICS; MOLDS; THICKNESS MEASUREMENT;

NANOIMPRINT LITHOGRAPHY;

EID: 64549112269     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.3089324     Document Type: Article

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