Evaluation of thermal-aware design techniques for microprocessors

ASICON 2005: 2005 6th International Conference on ASIC, Proceedings

Volumn 1, Issue , 2005, Pages 62-65

  Richardson, Thomas D ^a   Yuan, Xie ^a  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATION THEORY; MICROPROCESSOR CHIPS; RELIABILITY; THERMAL EFFECTS; VLSI CIRCUITS;

ARCHITECTURAL POWER; HOT FUNCTIONAL UNITS; MIGRATING COMPUTATION (MC); TEMPERATURE ESTIMATION;

INTEGRATED CIRCUIT LAYOUT;

EID: 33847382055     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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