Highly reliable probe card for wafer testing

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1152-1156

  Maekawa, S ^a   Takemoto, M ^a   Kashiba, Y ^a   Deguchi, Y ^b   Miki, K ^b   Nagata, T ^c  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

^b Manufacturing Technology and Production Management Division   (Japan)

^c System LSI Division   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; BONDING; ELECTRIC RESISTANCE; PLASTIC DEFORMATION; RELIABILITY; SILICON WAFERS; SURFACE ROUGHNESS; TUNGSTEN;

ALUMINUM BONDING PAD; PROBE CARD; WAFER TESTING;

ELECTRIC CONTACTS;

EID: 0034480259     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)