Experimental method and FE simulation model for evaluation of wafer probing parameters

Microelectronics Journal

Volumn 37, Issue 9, 2006, Pages 871-883

  Liu, D S ^a   Shih, M K ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Finite element method; Micro force tests; Needle probe; Wafer probing test

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; NUMERICAL METHODS; PARAMETER ESTIMATION; PROBES; SEMICONDUCTOR MATERIALS;

MICRO-FORCE TESTS; NEEDLE PROBE; SUITABLE PROBE GEOMETRY; WAFER PROBING TEST;

WSI CIRCUITS;

EID: 33746025354     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2006.03.001     Document Type: Article

References (17)

1. Cprobe Corporation Introduction Blade Type Probe Card. Available: http://www.cerprobe.com/CRPB/Products/Probe_Cards/default.asp, 2002.
2. J. Leung, Overview of C4 array probing, Presented at the Ninth International Conference IEEE SouthWest Test WorkShop, San Diego, USA, 1999.
3. Apan Electronic Materials Corporation Introduction Vertical-Contact Probe Card. Available: http://www.jemam.com/contact.html, 2002.
4. K. Smith, Membrane cards with microscrub technology, Presented at the Ninth International Conference IEEE SouthWest Test WorkShop, San Diego, USA, 1999.
5. T. Homorodi, R. Martin, High parallelism memory test advances based on MicroSpringTM contact technology, Presented at the 11th International Conference IEEE SouthWest Test WorkShop, San Diego, USA, 2001.
6. N.L. Tracy, R. Rothenberger, C. Copper, N. Corman, G. Biddle, A. Matthews, S. McCarthy, Array sockets and connectors using MicroSpringTM technology, Presented at the 26th International Conference IEEE Electronic Manufacturing Technology Symposium, 2000, pp. 129-140.
7. NanoNexus Inc. http://www.nanonexus.com/
8. K. Kataoka, T. Itoh, K. Okumura, T. Suga, Development of low-force copper contact processes, Presented at the 49th International Conference IEEE Holm Conference on Electrical Contacts, 2003, pp. 228-233.
9. M.J. Varnau, Impact of wafer probe damage on flip chip yields and reliability, Presented at the 19th International Conference IEEE/CPMT International Electronics Manufacturing Technology Symposium, 1996, pp. 293-297.
10. Q. Tan, C. Beddingfield, A. Mistry, Reliability evaluation of probe-before-bump technology, Presented at the 24th International Conference IEEE/CPMT International Electronics Manufacturing Technology Symposium, 1999, pp. 320-324.
11. G. Hotchkiss, G. Ryan, W. Subido, J. Broz, S. Mitchell, R. Rincon, R. Rolda, L. Guimbaolibot, Effect of probe damage on wire bond Integrity, Presented at the 51st International Conference IEEE Electronic Components and Technology Conference, 2001, pp. 1175-1180.
12. J.J. Broz, R.M. Rincon, Probe contact resistance variations during elevated temperature wafer test, IEEE Itc International Test Conference, 1999, pp. 396-405.
13. S. Maekawa, M. Takemoto, Y. Kashiba, Y. Deguchi, K. Miki, T. Nagata, Highly reliable probe card for wafer testing, Presented at the 50th International Conference IEEE Electronic Components and Technology Conference, 2000, pp. 1152-1156.
14. J.O. Hallquist, LS-DYNA User's Manual-Version 940, Livermore Software Technology Corporation, June 1997.
15. D.T. Read, J.W. Dally, Mechanical Behavior of Aluminum and Copper Thin Films, American Society of Mechanical Engineers, Applied Mechanics Division, AMD, Mechanics and Materials for Electronic Packaging, 1994, pp. 41-49.
16. Enhanced Standard Cantilever Epoxy Probe Cards. Available: http://www.knstaiwan.com
17. Blu-Si, Inc. Available: http://www.blu-si.com