Impact of wafer probe damage on flip chip yields and reliability

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1996, Pages 293-297

  Varnau, Michael J ^a  

^a DELPHI CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CORROSION RESISTANCE; CRYSTAL DEFECTS; RELIABILITY; SOLDERED JOINTS; SOLDERING; THERMAL CYCLING;

UNDER BUMP METALLURGY; WAFER PROBE DAMAGE;

FLIP CHIP DEVICES;

EID: 0030414890     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)