Probe contact resistance variations during elevated temperature wafer test

IEEE International Test Conference (TC)

Volumn , Issue , 1999, Pages 396-405

  Broz, Jerry J ^a   Rincon, Reynaldo M ^a  

^a Advanced Probing Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BERYLLIUM COMPOUNDS; ELASTIC MODULI; ELECTRIC RESISTANCE; PALLADIUM ALLOYS; SILICON WAFERS; TEMPERATURE; TUNGSTEN COMPOUNDS;

BERYLLIUM COPPER PROBES; JOULE HEATING; PROBE CONTACT; TUNGSTEN RHENIUM PROBES; WAFER TEST;

SEMICONDUCTOR DEVICE TESTING;

EID: 0033335961     PISSN: 10893539     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (27)