Plastic-silicon bonding for MEMS packaging application

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2007, Pages

  Xia, Lou ^a   Zhihong, Li ^a   Yufeng, Jin ^a  

^a PEKING UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; MEMS; PLASTICS; POLYCARBONATES; POLYMETHYL METHACRYLATES; SILICON;

BONDING TECHNOLOGY; MANUAL OPERATION;

ELECTRONICS PACKAGING;

EID: 34948893340     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359792     Document Type: Conference Paper

References (5)

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2. Yu-Chuan Su; Lin, L., "Localized bonding processes for assembly and packaging of polymeric MEMS", Transactions on Advanced Packaging, Volume 28, Issue 4, Nov.2005 pp.:635-642
3. th Electronic Technology Conference, Volume 1, pp.231-237, 7-9 Dec. 2005
4. nd Annual International IEEE-EMB Special Topic Conference on Microtechnologies in Medicine & Biology, 2-4 May 2002 pp.66-70
5. C T Pan, "Selective low temperature microcap packaging technique through flip chip and wafer level alignment", Journal of Micromechanics and Microengneering, 14 (2004) pp. 522-529