Reliability evaluation of probe-before-bump technology

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1999, Pages 320-324

  Tan, Qing ^a   Beddingfield, Craig ^a   Mistry, Addi ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PROBE-BEFORE-BUMP TECHNOLOGY;

ALUMINUM; GOLD; NICKEL; RELIABILITY; SEMICONDUCTOR DEVICE MANUFACTURE;

SILICON WAFERS;

EID: 0033350892     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)