An experimental and numerical investigation into multilayer probe card layout design

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 29, Issue 3, 2006, Pages 163-171

  Liu, D S ^a   Shih, M K ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Finite element method (FEM); Microforce tests; Multilayer needle card; Wafer probing test

Indexed keywords

COMPUTATIONAL METHODS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; MATHEMATICAL MODELS; MULTILAYERS; SILICON WAFERS;

MICROFORCE TESTS; MULTILAYER NEEDLE CARD; WAFER PROBING TEST;

PRINTED CIRCUIT DESIGN;

EID: 33750128413     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2006.881764     Document Type: Article

References (9)

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