High repetition rate femtosecond laser forming sub-10 νm diameter interconnection vias

Journal of Physics D: Applied Physics

Volumn 42, Issue 6, 2009, Pages

  Tan, B ^a   Panchatsharam, S ^a   Venkatakrishnan, K ^a  

^a RYERSON UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

FORMING; LASER ABLATION; LASERS; MACHINING; PULSED LASER DEPOSITION; THICKNESS MEASUREMENT; ULTRASHORT PULSES; YTTERBIUM;

ABLATION DEPTHS; ABLATION RATES; AIR ENVIRONMENTS; FEMTO SECOND LASER PULSE; FEMTO-SECOND LASERS; FEMTOSECOND LASER MICROMACHINING; HIGH PRECISION; HIGH REPETITION RATES; LASER PARAMETERS; LOW-POWER; MACHINING QUALITIES; MANUFACTURING METHODS; MICROVIA; MICROVIAS; NANOSECOND LASERS; REPETITION RATES; SHORT-PULSE LASERS; SILICON SUBSTRATES; SYSTEMATIC STUDIES; THRESHOLD ENERGIES; VIA DRILLINGS;

PULSED LASER APPLICATIONS;

EID: 63649097739     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/42/6/065102     Document Type: Article

References (29)

1. Meier D et al 2002 PCB laser technology for rigid and flex HDI-via formation, structuring, routing IPC Printed Circuits Expo (2002)
2. Herman P R, Marjoribanks R S and Oettl A Burst-ultrafast laser machining method US Patent 6,552,301 B2
3. Tan B and Venkatakrishnan K 2007 Nd-YAG laser microvia drilling for interconnection application J. Micromech. Microeng. 17 1511-7
4. Tan B and Venkatakrishnan K 2006 Thermal coupling in multishot laser microvia drilling for interconnection application J. Vac. Sci. Technol. B 24 211-5
5. Venkatakrishnan K, Tan B, Stanley P and Sivakumar N R 2002 The effect of polarization on ultrashort pulsed laser ablation of thin metal films J. Appl. Phys. 92 1604-7
6. Le Harzic R, Huot N, Audouard E, Jonin C, Laporte P, Valette S, Fraczkiewicz A and Fortunier R 2002 Comparison of heat-affected zones due to nanosecond and femtosecond laser pulses using transmission electronic microscopy Appl. Phys. Lett. 80 3886-8
7. Preuss S and Stuke M 1995 Subpicosecond ultraviolet laser ablation of diamond Appl. Phys. Lett. 67 338-40
8. Hommes V, Miclea M and Hergenroder R 2006 Silicon surface morphology study after exposure to tailored femtosecond pulses Appl. Surf. Sci. 252 7449-60
9. Schaffer C, Broideur A, Nishimura N and Mazur E 1999 Laser-induced microexplosions in transparent materials: microstructuring with nanojoules SPIE 3616 143
10. Wen S et al 2007 Analysis of laser ablation: contribution of ionization energy to the plasma and shock wave properties J. Appl. Sci. 102 043103
11. Kruger J and Kautek W 1999 The femtosecond pulse laser: a new tool for micromachining Laser Phys. 9 30-40
12. Perrie W, Gill M, Robinson G, Fox P and O'Neil W 2004 Femtosecond laser micro-structuring of aluminum under helium Appl. Surf. Sci. 230 50-9
13. Venkatakrishnan K and Tan B 2007 Thin silicon wafer dicing with a dual-focused laser beam J. Micromech. Microeng. 17 2505-15
14. Xu L, Lowney D, McNally P J, Borowiec A, Lankinen A, Tuomi T O and Danilewsky A N 2007 Femtosecond versus nanosecond laser micro-machining of InP: a non-destructive three-dimensional analysis of strain Semicond. Sci. Technol. 22 970-9
15. Tan B and Venkatakrishnan K 2006 A femtosecond laser-induced periodical surface structure on crystalline silicon J. Micromech. Microeng. 16 1080-5
16. Tan B, Venkatakrishnan K and Tok K G 2003 Selective surface texturing using femtosecond pulsed laser induced forward transfer Appl. Surf. Sci. 207 365-71
17. Lee S, Yang D F and Nikumb S 2008 Femtosecond laser micromilling of Si wafers Appl. Surf. Sci. 254 2996-3005
18. Venkatakrishnan K, Tan B and Ngoi B K A 2002 Femtosecond pulsed laser ablation of thin gold film Opt. Laser Technol. 34 199-202
19. Lau J H and Lee S W R 2001 Microvias for Low Cost, High Density Interconnects (New York: McGraw-Hill)
20. 2001 International Technology Roadmap for Semiconductors
21. Venkatakrishnan K, Sudani N and Tan B 2008 A high-repetition rate femtosecond laser for thin silicon wafer dicing J. Micromech. Microeng. 18 075032
22. Gamaly E G, Rode A V, Tikhonchuk V T and Luther-Davies B 2002 Ablation of solids by femtosecond lasers-ablation mechanism and ablation thresholds for metals and dielectrics Phys. Plasmas 9 949-57
23. Wang X C, Lim G C, Zheng H Y, Ng F L, Liu W and Chua S J 2004 Femtosecond pulse laser ablation of sapphire in ambient air Appl. Surf. Sci. 228 221-6
24. Herman P R, Eaton S M, Zhang H and Li J 2006 Femtosecond laser waveguide writing-contrasting interactions at MHz and kHz repetition rates Invited Talk ThT3, LEOS Annual Meeting (Montreal, QC, Canada)
25. Eaton S M, Zhang H B and Herman P R 2005 Heat accumulation effects in femtosecond lasers written waveguides with variable repetition rate Opt. Express 13 4708-16
26. Schaffer C, Garcia J and Mazur E 2003 Bulk heating of transparent materials using a high-repetition rate femtosecond laser J. Appl. Phys. A 76 351-4
27. Rok P, Igor P, Ales B and Janez M 2006 Optodynamic study of multiple pulses micro drilling Ultrasonics 44 E1191-4
28. Gattass R R, Cerami L R and Mazur E 2006 Micromachining of bulk glass with bursts of femtosecond laser pulses at variable repetition rates Opt. Express 14 5279
29. Reichman W J, Krol D M, Shah L, Yoshino F, Arai A, Eaton S M and Herman P R 2006 A spectroscopic comparison of femtosecond-laser-modified fused silica using kilohertz and megahertz laser systems J. Appl. Phys. 99 123112