Thermal coupling in multishot laser microvia drilling for interconnection application

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 24, Issue 1, 2006, Pages 211-215

  Tan, B ^a   Venkatakrishnan, K ^a  

^a RYERSON UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

DELAY CIRCUITS; LASER PULSES; LASERS; METALLIZING; THERMAL EFFECTS;

MULTISHOT LASER MICROVIA; THERMAL COUPLING;

COUPLED CIRCUITS;

EID: 31544451588     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2162573     Document Type: Article

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