Monolithic integration of capacitive sensors using a double-side CMOS MEMS post process

Journal of Micromechanics and Microengineering

Volumn 19, Issue 1, 2009, Pages

  Sun, Chih Ming ^a   Wang, Chuanwei ^a   Tsai, Ming Han ^a   Hsieh, Hsieh Shen ^a   Fang, Weileun ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELEROMETERS; ETCHING; MEMS; MICROELECTROMECHANICAL DEVICES; PRESSURE SENSORS; PRESSURE TRANSDUCERS; SEMICONDUCTING SILICON COMPOUNDS; TOOLS; WIRELESS TELECOMMUNICATION SYSTEMS;

ACCELERATED MEASUREMENTS; BULK SILICON ETCHINGS; CAPACITIVE SENSORS; CAPACITIVE TRANSDUCERS; CMOS PROCESS; CMOS-MEMS; COMPLEMENTARY METAL OXIDE SEMICONDUCTORS; IN-PLANE DIRECTIONS; MEASUREMENT RESULTS; MONOLITHIC INTEGRATIONS; OUT-OF-PLANE DIRECTIONS; POST PROCESS; SENSING CIRCUITS; SENSING RANGES; SINGLE CHIPS; SURFACE METAL LAYERS;

CMOS INTEGRATED CIRCUITS;

EID: 62649108958     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/1/015023     Document Type: Article

References (16)

1. Parameswaran M, Chung R, Gaitan M, Johnson R B and Syrzycki M 1991 Commercial CMOS fabricated integrated dynamic thermal scene simulator IEDM'91 (Washington, DC, December 8-11) pp 753-56
2. Fedder G K 2005 CMOS-based sensors IEEE Sensors 2005 (CA, USA Oct. 30-Nov. 3) pp 125-28
3. Fedder G K, Santhanam S, Reed M L, Eagle S C, Guillou D F, Lu M S-C and Carley L R 1996 Laminated high-aspect-ratio microstructures in a conventional CMOS process Sensors Actuators A 57 103-10
4. Dai C-L, Xiao F-Y, Juang Y-Z and Chiu C-F 2005 An approach to fabricating microstructures that incorporate circuits using a post-CMOS process J. Micromech. Microeng. 15 98-103
5. Xie H, Erdmann L, Zhu X, Gabriel K J and Fedder G K 2002 Post-CMOS processing for high-aspect-ratio integrated silicon microstructures IEEE/ASME J. MEMS 11 93-101
6. Wang C, Tsai M-H, Sun C-M and Fang W A 2007 A novel CMOS out-of-plane accelerometer with fully-differential gap-closing capacitance sensing electrodes J. Micromech. Microeng. 17 1275-80
7. Paul O and Baltes H 1995 Novel fully CMOS-compatible vaccuum sensor Sensors Actuators A 46/47 143-6
8. Luo H, Zhang G, Carley L R and Fedder G K 2002 A post-CMOS micromachined lateral accelerometer IEEE/ASME J. MEMS 11 188-95
9. Graf M, Jurischka R, Barrettino D and Hierlemann A 2005 3-D nonlinear modelling of microhotplates in CMOS technology for use as metal-oxide-based gas sensors J. Micromech. Microeng. 15 190-200
10. Afridi M Y, Suehle J S, Zaghloul M E, Berning D W, Hefiner A R, Cavicchi R E, Semancik S, Montgomery C B and Taylor C J 2002 A monolithic CMOS microhotplate- based gas sensor system IEEE Sensors J. 2 644-55
11. Neumann J and Gabriel K 2002 CMOS-MEMS membrane for audio-frequency acoustic actuation Sensors Actuators A 95 175-82
12. Parameswaran L, Hsu C and Schmidt M A 1995 A merged MEMS-CMOS. process using silicon wafer bonding IEDM'95 pp 613-6
13. Dehennis A D and Wise K D 2005 A wireless microsystem for the remote sensing of pressure, temperature, and relative humidity IEEE/ASME J. MEMS 14 12-22
14. Hagleitner C, Lange D, Hierlemann A, Brand O and Baltes H 2002 CMOS single-chip gas detection system comprising capacitive, calorimetric and mass-sensitive microsensors IEEE J. Solid State Circuits 37 1867-78
15. Tsai J M and Fedder G K 2005 Mechanical noise-limited CMOS-MEMS accelerometers IEEE MEMS'05 (Miami Beach, FL, Jan. 30-Feb. 3) pp 630-3
16. Sun C-M, Wang C-W and Fang W 2008 On the sensitivity improvement of CMOS capacitive accelerometer Sensors Actuators A 141 347-52