Thermomechanical behaviour of PBGA package during laser and hot air reflow soldering

Modelling and Simulation in Materials Science and Engineering

Volumn 12, Issue 2, 2004, Pages 235-243

  Tian, Yanhong ^a   Wang, Chunqing ^a   Liu, Deming ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b ASM Assembly Automation Ltd   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

LASER HEATING; PLASTIC BALL-GRID-ARRAY (PBGA);

COMPUTER SIMULATION; FINITE ELEMENT METHOD; LASER BEAM EFFECTS; LOW TEMPERATURE EFFECTS; SOLDERING; TEMPERATURE DISTRIBUTION;

THERMOMECHANICAL TREATMENT;

EID: 1642317993     PISSN: 09650393     EISSN: None     Source Type: Journal    
DOI: 10.1088/0965-0393/12/2/005     Document Type: Article

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