Failure modes of lead free solder bumps formed by induction spontaneous heating reflow

Journal of Materials Science and Technology

Volumn 23, Issue 1, 2007, Pages 61-67

  Li, Mingyu ^a   Xu, Hongbo ^a   Kim, Jongmyung ^b   Kim, Hongbae ^b  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b Jeonnam Provincial College   (South Korea)

Author keywords

Failure mode; Induction spontaneous heating reflow; Lead free solder; Shear test

Indexed keywords

AGING OF MATERIALS; COPPER ALLOYS; MORPHOLOGY; SHEARING; SILVER ALLOYS; SOLDERING ALLOYS; TESTING; TIN ALLOYS;

CROSS SECTIONS; FRACTURE SURFACES; INDUCTION SPONTANEOUS HEATING REFLOW; LEAD FREE SOLDER; SHEAR FAILURE MODES; SHEAR TEST;

FAILURE MODES;

EID: 33947285665     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (21)

1. M. Abtew and G. Selvaduray: Mater. Sci. Eng. R, 2000, 27(5-6), 95.
2. K. Suganuma: Curr. Opin. Solid St. M., 2001, 5(1), 55.
3. C. M. L. Wu, D. Q. Yu, L. Wang and C. M. T. Law: Mater. Sci. Eng. R, 2004, 44(1), 1.
4. C. H. Chien, Y. C. Chen, T. Y. Chiou, T. P. Chen, C. C. Hsieh, J. J. Yan, W. Z. Chen and Y. D. Wu: Microelectron. Reliability, 2003, 43(1), 131.
5. Y. Sawada, K. Harada and H. Fujioka: Microelectron. Reliability, 2003, 43(3), 465.
6. C. Y. Ni, D. S. Liu and C. Y. Chen: Microelectron. Reliability, 2002, 42(12), 1903.
7. Y. H. Tian, C. Q. Wang, X. S. Ge, P. Liu and D. M. Liu: Mater. Sci. Eng. B, 2002, 95(3), 254.
8. Y. H. Tian, C. Q. Wang and D. M. Liu: Model. Simul Mater. Sc., 2004, 12(2), 235.
9. Mingyu LI, Rong AN and Chunqing WANG: Acta Metal. Sin., 2004, 40(10), 1093. (in Chinese)
10. D. Z. Li, C. Q. Liu and P. P. Conway: Mater. Sci. Eng. A, 2005, 391(1-2), 95.
11. K. S. Kim, K. W. Ryu, C. H. Yu and J. M. Kim: Microelectron. Reliability, 2005, 45(3-4), 647.
12. N. Duan, J. Scheer, J. Bielen and M. van Kleef: Microelectron. Reliability, 2003, 43(8), 1317.
13. M. He, Z. Chen and G. J. Qi: Acta Mater., 2004, 52(7), 2047.
14. M. N. Islam and Y. C. Chan: Mater. Sci. Eng. B, 117(3), 246.
15. W. C. Y. Esther, F. G. Jing and P. Chan: Microelectron. Reliability, 2004, 44(2), 323.
16. M. Kitajima and T. Shono: Microelectron. Reliability, 2005, 45(7-8), 1208.
17. X. J. Huang, S. W. R. Lee and C. C. Yan: Proc. 52nd Electronic Components and Technology Conference (ECTC), San Diego, CA, 2002, 968.
18. K. Y. Lee, M. Li, D. R. Olsen, W. T. Chen, B. Tan and S. Mhaisalkar: Proc. 51st Electronic Components and Technology Conference (ECTC), Orlando, Florida, USA., 2001, 478.
19. K. S. Kim, S. H. Huh and K. Suganuma: J. Alloy. Compd., 2003, 352(1-2), 226.
20. G. J. Ewell and S. R. Robertson: Proc. 2nd Int. Symp. on Electronic Packaging Technology, Shanghai, China, 1996, 73.
21. K. N. Tu and K. Zeng: Mater. Sci. Eng. R, 2001, 34(1), 1.