Lead-free interconnect technique by using variable frequency microwave

Journal of Electronic Materials

Volumn 34, Issue 7, 2005, Pages 1081-1088

  Moon, Kyoung Sik ^a   Li, Yi ^a   Xu, Jianwen ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Intermetallic compound (IMC); Lead free solder; Low temperature lead free interconnects; Reflow process; Selective heating; Variable frequency microwave (VFM)

Indexed keywords

COPPER; HEATING; INTERMETALLICS; MELTING; MICROSTRUCTURE; MICROWAVES; RELIABILITY; SCANNING ELECTRON MICROSCOPY; THERMAL STRESS; TIN;

LEAD-FREE SOLDER; LOW-TEMPERATURE LEAD-FREE INTERCONNECTS; REFLOW PROCESS; SELECTIVE HEATING; VARIABLE FREQUENCY MICROWAVE (VFM);

SOLDERED JOINTS;

EID: 23244444658     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0099-0     Document Type: Article

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