Eddy current induced heating for the solder reflow of area array packages

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 2, 2008, Pages 399-403

  Li, Mingyu ^a   Xu, Hongbo ^a   Lee, Shi Wei Ricky ^b   Kim, Jongmyung ^c   Kim, Daewon ^c  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^c Jeonnam Provincial College   (South Korea)

Author keywords

Area array packaging; Eddy current; Induction heating; Lead free soldering; Localized heating

Indexed keywords

ELECTROMAGNETIC FIELDS; FLIP CHIP DEVICES; INDUCTION HEATING; SOLDERING ALLOYS; THERMAL GRADIENTS;

AREA ARRAY PACKAGING; BOARD LEVEL REFLOW; LOCALIZED HEATING;

ELECTRONICS PACKAGING;

EID: 44449086514     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.923385     Document Type: Article

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