Exploring the water-soluble phosphine ligand as the environmentally friendly stabilizer for electroless nickel plating

Industrial and Engineering Chemistry Research

Volumn 48, Issue 4, 2009, Pages 1727-1734

  Wang, Ke ^a   Hong, Liang ^a,b   Liu, Zhao Lin ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMICAL CORROSION; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY; ELECTROPLATING; LEAD; LIGANDS; NICKEL; NICKEL ALLOYS; NICKEL PLATING; PHOSPHORUS; PHOSPHORUS COMPOUNDS; REACTION KINETICS; SOLVENTS;

BULK PHASE; DEPTH-PROFILE ANALYSIS; ELECTROCHEMICAL-IMPEDANCE SPECTROSCOPIES; ELECTROLESS NICKEL PLATINGS; ENVIRONMENTALLY-FRIENDLY; HOMOGENEOUS CATALYSIS; NICKEL ATOMS; OUT OF CONTROLS; PERCOLATION CONCENTRATIONS; PHOSPHINE LIGANDS; PHOSPHORUS CONTENTS; PLATING BATHS; PLATING LAYERS; TRIPHENYLPHOSPHINE; TRISULFONIC ACIDS; WEIGHT PERCENTS;

CORROSION RESISTANCE;

EID: 61849161095     PISSN: 08885885     EISSN: None     Source Type: Journal    
DOI: 10.1021/ie801456f     Document Type: Article

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