Stabilization effect of electroless nickel plating by thiourea

Metal Finishing

Volumn 95, Issue 2, 1997, Pages 73-75

  Keping, Han ^a   Fang, Jing Li ^a  

^a NANJING UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC POLARIZATION; BINDING ENERGY; CATALYST ACTIVITY; CHEMICAL BONDS; ELECTROCHEMISTRY; ELECTROLESS PLATING; HYDROGEN; OXIDATION; SPECIMEN PREPARATION; SPECTROSCOPIC ANALYSIS; SULFUR COMPOUNDS; X RAY PHOTOELECTRON SPECTROSCOPY;

CATHODIC POLARIZATION; ELECTROCHEMICAL MEASUREMENTS; POTENTIOSTAT; THIOUREA;

NICKEL PLATING;

EID: 0031076942     PISSN: 00260576     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-0576(97)81818-1     Document Type: Article

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