Effect of thiourea and lead acetate on the deposition of electroless nickel

Materials Chemistry and Physics

Volumn 76, Issue 2, 2002, Pages 204-211

  Lin, Kwang Lung ^a   Hwang, Jia Wei ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Electroless nickel; Lead acetate; Thiourea

Indexed keywords

ATOMIC FORCE MICROSCOPY; CRYSTALLIZATION; LEAD COMPOUNDS; MORPHOLOGY; NICKEL; PH EFFECTS; SCANNING ELECTRON MICROSCOPY;

CRYSTALLINITY; ELECTROLESS NICKEL;

ELECTROLESS PLATING;

EID: 0037102802     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(01)00516-8     Document Type: Article

References (16)

1. Application of electroless nickel plating in the semiconductor microcircuit industry
2. The interactions between In-Sn solders and an electroless Ni-P deposit upon heat treatment
3. A roadmap to low cost flip chip and CSP using electroless Ni/Au
4. Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
5. Electroless nickel plating - A review
6. The plating rates and physical properties of electroless nickel/phosphorus alloy deposits
7. Factors influencing damascene feature fill using copper PVD and electroplating
8. Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum
9. Characteristics of the chemical reduction of nickel alloys with hypophosphite
10. On the mechanism of electroless plating. II. One mechanism for different reductants
11. Acceleration effect of electroless nickel deposition by thiourea