Electroless deposition of Ni-Cu-P alloys in acidic solutions

Electrochemical and Solid-State Letters

Volumn 2, Issue 7, 1999, Pages 323-325

  Armyanov, S ^a,c   Georgieva, J ^a   Tachev, D ^a   Valova, E ^a   Nyagolova, N ^a   Mehta, S ^b   Leibman, D ^b   Ruffini, A ^b,c  

^a INSTITUTE OF PHYSICAL CHEMISTRY   (Bulgaria)

^b OMG Fidelity Incorporated   (United States)

^c ELECTROCHEMICAL SOCIETY   (Bulgaria)

Author keywords

[No Author keywords available]

Indexed keywords

ACIDIC SOLUTIONS;

CORROSION RESISTANCE; ELECTROLESS PLATING; ENERGY DISPERSIVE SPECTROSCOPY; NICKEL ALLOYS; NICKEL PLATING; SOLUTIONS; TERNARY SYSTEMS; THERMODYNAMIC STABILITY;

AMORPHOUS ALLOYS;

EID: 0032647186     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1390824     Document Type: Article

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