Modeling the stability of electroless plating bath - Diffusion of nickel colloidal particles from the plating frontier

Journal of Colloid and Interface Science

Volumn 262, Issue 1, 2003, Pages 89-96

  Yin, X ^d   Hong, L ^a   Chen, B H ^b   Ko, T M ^c  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^c IBM MICROELECTRONICS   (United States)

^d NONE

Author keywords

Diffusion; Electroless nickel plating; Metal colloidal particles; Modeling; Solution stability

Indexed keywords

ADSORPTION; ELECTROLESS PLATING; MATHEMATICAL MODELS; NICKEL PLATING; SILICON WAFERS; SOLUTIONS; SUBSTRATES;

PLATING SOLUTIONS;

DIFFUSION;

CYSTEINE; HYDROGEN; NICKEL;

ACCELERATION; ADSORPTION; ARTICLE; COLLOID; DECOMPOSITION; DIFFUSION; MATHEMATICAL MODEL; MODEL; PLATING MEDIUM; PRECIPITATION; PRIORITY JOURNAL; REDUCTION; SIMULATION; TEMPERATURE DEPENDENCE;

EID: 0038218028     PISSN: 00219797     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0021-9797(03)00191-7     Document Type: Article

References (29)

1. Brenner A., Riddell G. J. Res. Natl. Bur. Stand. 37:1946;31.
2. Schenzel H.G., Kreye H. Plat. Surf. Finish. 77:(10):1990;50.
3. Di Bari G.A. Plat. Surf. Finish. 85:(11):1998;54.
4. Ting C.H., Paunovic M., Pai P.L., Chiu G. J. Electrochem. Soc. 136:1989;462.
5. Dubin V.M. J. Electrochem. Soc. 139:1992;633.
6. Honma H., Watanabe H., Kobayashi T. J. Electrochem. Soc. 141:1994;1791.
7. Watanabe H., Honma H. J. Electrochem. Soc. 144:1997;471.
8. Onahue F.M., Yu C.U. Electrochim. Acta. 15:1970;237.
9. Jusys Z., Liankonis J., Vaskelis A. J. Electrochem. Soc. 307:1991;87.
10. Abrates L.M., Oliveira M.C., Vieil E. Electrochim. Acta. 41:(9):1996;1515.
11. Meerakker V.D. J. Appl. Electrochem. 11:1981;395.
12. Li L., Chen W., Gui Z. Ferroelectrics. 231:(1-4):1999;793-798.
13. Podesta J.J., Piatti R.C.V., Arvia A.J. J. Appl. Electrochem. 20:(2):1990;245.
14. Ohno I., Wakabayashi O., Haruyama S. J. Electrochem. Soc. 132:(10):1985;2323.
15. Gutzeit G. Plating. 46:1959;1158.
16. Feldstein N., Lancsek T.S. J. Electrochem. Soc. 118:1971;869.
17. Han K., Jing L.F. Met. Finish. 95:(2):1997;73.
18. Kelber J., Seshadri G. Surf. Interface Anal. 31:2001;431.
19. Zhang S., De Baets J., Vereeken M., Vervaet A., Van Calster A. J. Electrochem. Soc. 146:(8):1999;2870-2875.
20. Yiacoumi S., Tien C. Kinetics of Metal Ion Adsorption from Aqueous Solutions: Models, Algorithms, and Applications. 1995;Kluwer Academic, Boston. p. 11.
21. Rieger P.H. Electrochemistry. 1994;Chapman & Hall, London.
22. Hiemenz P.C., Rajagopalan R. Principles of Colloid and Surface Chemistry. 3rd ed. 1997;Dekker, New York.
23. Hunter R.J. Foundations of Colloid Science, Vol. 1. 1986;Clarendon, Oxford.
24. Hunt W.J., Zukoski C.F. J. Colloid Interface Sci. 195:1997;32.
25. McClurg R.B., Zukoski C.F. J. Colloid Interface Sci. 208:1998;529.
26. Crank J. The Mathematics of Diffusion. 2nd ed. 1975;Clarendon, Oxford.
27. Nelder J.A., Mead R. Comput. J. 7:1964;308.
28. Dennis D.E. Jr., Woods D.J. Wouk A. New Computing Environments: Microcomputers in Large-Scale Computing. 1987;116 SIAM, Philadelphia.
29. Levine I.N. Physical Chemistry. 4th ed. 1995;McGraw-Hill, New York.