Role of a Pb 2+ stabilizer in the electroless nickel plating system: A theoretical exploration

Journal of Physical Chemistry B

Volumn 108, Issue 30, 2004, Pages 10919-10929

  Yin, X ^a,b   Hong, L ^a   Chen, B H ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION RATE; ELECTROLESS NICKEL PLATING; OXIDATIVE-ADDITION; STABILIZATION MECHANISM;

ADDITION REACTIONS; COMPUTATIONAL METHODS; ELECTROLESS PLATING; ELECTRONS; LEAD; OXIDATION; OXYGEN; STABILIZERS (AGENTS);

NICKEL PLATING;

EID: 4043154380     PISSN: 15206106     EISSN: None     Source Type: Journal    
DOI: 10.1021/jp036070k     Document Type: Article

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